1 / 4 www.asb.co.kr june 20 17 p lerow tm ALN1800T2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or w ithout the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, hi gh gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package inc luding the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 1700 1900 gain db 25 26 gain flatness db ? 0.8 ? 1.0 noise figure db 0.65 0.70 output ip3 (1) dbm 33 34 s11 / s22 (2) db - 14 / - 14 output p1db dbm 20 21 switching time (3) ? sec - supply current ma 100 120 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured w ith two tones at an output power of 7 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) s 21 = 26.8 db @ 1700 mhz = 25.2 db @ 1900 mhz nf of 0.65 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as s hown in the dra w ing at the left side. (recommended footprint) aln1 800t2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co .kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. =1800 mhz, z o.sys = 50 ohm feature s description
2 / 4 www.asb.co.kr june 20 17 p lerow tm ALN1800T2 internally matched lna module s - param e ters noise figure oip3 p1db wcdma 1700~1900 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr june 20 17 p lerow tm ALN1800T2 internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cur rent (ma) 4.5 - 16.07 - 18.20 26.35 1.65 0.687 20.04 32.33 70 4.6 - 16.36 - 18.22 26.43 1.67 0.674 20.45 32.86 75 4.7 - 16.73 - 18.18 26.50 1.72 0.677 20.89 33.19 80 4.8 - 17.17 - 18.19 26.56 1.69 0.679 21.24 33.77 85 4.9 - 17.49 - 18.10 26.61 1.68 0.678 21.47 34.02 91 5.0 - 17.73 - 18.20 26.65 1.67 0.670 21.80 34.25 96 5.1 - 18.17 - 18.15 26.69 1.78 0.684 22.02 34.42 101 5.2 - 18.48 - 18.12 26.72 1.78 0.682 22.18 34.60 105 5.3 - 18.74 - 18.06 26.74 1.68 0.675 22.38 34.64 110 5.4 - 19.09 - 18.05 26.76 1.68 0.674 22.6 0 34.78 114 5.5 - 19.38 - 17.99 26.79 1.70 0.680 22.67 34.86 117 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 18.55 - 17.35 26.98 1.63 0.440 21.41 34.40 90 - 20 ? c - 18.36 - 17.67 26.96 1.64 0.494 21 .47 34.27 92 0 ? c - 17.99 - 18.00 26.84 1.67 0.556 21.57 34.20 94 25 ? c - 17.8 - 18.13 26.64 1.68 0.663 21.85 34.23 96 40 ? c - 17.83 - 18.87 26.39 1.65 0.722 21.8 34.33 97 60 ? c - 17.73 - 19.10 26.24 1.68 0.798 21.79 34.55 96 80 ? c - 17.73 - 19.35 26.01 1.68 0.907 2 1.55 34.62 95 100 ? c - 17.15 - 19.15 25.87 1.67 1.011 21.32 34.26 93 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr june 20 17 p lerow tm ALN1800T2 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module . therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. copyright ? 2007 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process evaluation bo ard layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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